Technology, Equipment and Materials

US$200.00
Date of Publication: Mar 15, 2018
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$1,350.00
Date of Publication: Feb 14, 2019
PCB Technology Trends 2018 is based on data from 74 companies (52 electronics OEMs and 22 PCB fabricators) worldwide. PCB Technology Trends 2018 presents data on the current state (2018) of PCB fabrication and OEM's PCB requirements and their use of emerging technologies.

US$613.00
Date of Publication: Jul 17, 2017

IPC-6010-FAM, "Printed Board Performance Specifications" includes qualification and performance specification standards for all major types of printed boards.


US$533.00
Date of Publication: Jul 17, 2017
7090-FAM, IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.

US$702.00
Date of Publication: Jul 17, 2017
"Base Materials Specifications for Printed Boards", BdMATFAM - is a family of specifications for board materials used in the fabrication process.

US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$160.00
Date of Publication: Oct 9, 2013
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronics assemblies during mechanical loading.