Technology, Equipment and Materials

US$160.00
Date of Publication: Oct 9, 2013
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronics assemblies during mechanical loading. 

US$6,650.00
Date of Publication: Jan 12, 2016

This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.


US$4,975.00
Date of Publication: Dec 21, 2015
This report relates the emerging market for 3D printed electronics to the existing markets for printed electronics and 3D printing that we have been researching for years. We explain why some candidate applications will not succeed commercially and identify two main applications that will create a total market worth over $1bn by 2025 thanks to core advantages over competing technologies and huge addressable markets. In addition we explore many potential applications for fully 3D printed electronics. This report discusses all existing and emerging technologies that span 2D and 3D printed electronics, all major applications, all players bringing products to market in this space. Specifically, the inkjetting of conductive and insulating inks, extrusion of conductive pastes and insulators and the Aerosol Jet technology.

US$1,350.00
Date of Publication: May 29, 2015
Based on data from 158 PCB fabricators and assembly companies worldwide, this report presents data on the current state (2014) and the industry’s predictions for the data by 2019, collected for the 2015 IPC Technology Roadmap. The data are segmented by five applications: computer and telecommunications, consumer electronics, industrial and automotive, medical, and military and aerospace. Topics covered include clock speed, heat dissipation, operation cycles, environmental operating range, product life expectancy, lamination cycles, materials, board area, board thickness, layer count, embedded components, printed-in-place features, line width and spacing, via diameters, aspect ratios, surface-mount lands, I/O pitch, test density, recyclable content and component size, as well as numbers of vias, solder joints, and discrete, area array, peripheral leaded, peripheral leadless and through-hole components. Additional data that is not segmented by application covers voltage levels and optical channels.

US$3,750.00
Date of Publication: Jan 29, 2015
Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.

US$152.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$4,650.00
Date of Publication: May 11, 2015
Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application...