Workforce Training Products

Electronics.ca Knowledge Center offers access to some of the world's most renowned specialists in academia and industry. Our courses provide a comprehensive education for new employees, cross-training for your existing workforce, or pre-employment training for students entering the electronics industry. You can train, test and certify your employees in the fundamentals of semiconductor fabrication, PCB and electronics assembly. Give your employees access to the knowledge they need to advance their careers... provide opportunities for cross-training and self-education with the award-winning IPC Training Library. It's never been more cost-effective to implement a complete curriculum of core assembly knowledge. 

US$625.00
Date of Publication: Sep 26, 2016
Now updated to Revision F of the IPC-A-610 -- the Acceptability of Electronic Assemblies -- this media-based training program is a cost-effective and efficient way to train and test your entire workforce to the most widely recognized industry standard on surface mount solder joint criteria.

US$625.00
Date of Publication: Sep 26, 2016
DVD-71C is designed to help eradicate the most common inspection errors that occur in electronics assembly, including: misinterpreting inspector responsibilities, using improper board-side criteria, misunderstanding minimum electrical clearance, rejecting excessive wetting angles, requiring complete vertical fill, misinterpreting through-hole part clearance, misapplying gull wing lead style criteria, misidentifying bottom termination components, rejecting measles and treating billboarding as an instant defect.

US$625.00
Date of Publication: Jun 14, 2016

Useful as a training aid in the classroom, or on the shop floor, DRM-PTH-D contains computer generated color illustrations of component, barrel, and solder-side perspectives of a plated-through hole. Each drawing clearly shows the minimum acceptable condition for requirements such as land coverage, vertical fill, wetting of lead, land and barrel, and contact angle.DRM-PTH-D also contains high quality color microphotographs of the major solder defects and conditions, such as nonwetting, corrosion, projections, fractures, lead protrusion and disturbed joints, with pictures of both tin-lead and lead free solder joints. The appropriate specification / paragraph references from both the IPC-A-610D and J-STD-001D are included for each of the acceptance criteria for further verification. In addition, every change from the C to D revision has been notated to make it easy for your inspectors and operators to learn the new requirements. Quantity discounts available.


US$730.00
Date of Publication: Jun 14, 2016
DVD-SMT-E is an interactive training program is a cost effective and efficient way to train and test your entire workforce to the most widely recognized industry standards on surface mount solder joint acceptance criteria.

US$520.00
Date of Publication: Jul 18, 2016
Moisture Sensitive Devices, or "MSDs," have become a critical issue -- because of the higher temperatures involved in lead free soldering. This updated video training program provides an informative look at this "invisible" issue – to save your company time and money in preventing component malfunctions. If your operators understand why it's important to treat MSDs with care, they are more likely to avoid MSD issues.

US$578.00
Date of Publication: Jul 9, 2015
DVD-54C clearly explains all the critical information your operators need to control static charge build-ups and prevent costly damage to electronic components and assemblies. This DVD also covers: the physics of static electricity, how static charges damage components, grounding, wrist straps / shoe grounding / testing, safe clothing, conductive smocks, ESD-safe work areas, elimination of static generating materials, controlling charge build-ups, activities that create static electricity, and proper handling / storage / transportation of ESD sensitive devices.

US$520.00
Date of Publication: Jul 7, 2016
DVD-196C explains the advantages and challenges of area grid arrays, including component descriptions and terminology. Provides a visual overview of removal / replacement procedures for BGAs and QFNs, using both convection and IR equipment. Covers site preparation, reballing, component alignment, solder paste printing, preheating considerations and thermal profiles.